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Processing Equipment
Facilities for the rapid processing of the III-N structures are in the stage of development.
Etching system
Era-5M TCP system for chemical ion etching.
manufacturer: ESTO-Vacuum. Russia.
Technical data:
- Capacity: up to 6x2-inch substrates
- Samples position: vertical
- Charging by way of lock-chamber
- Turbo-molecular pump (low pressure 5x10-5 Pa)
- Separate whater heating and cooling for holder and camera.
- In-situ optical reflectance monitoring in the near-normal incident using Laser LED and Si photodetector.
- The etching process are operated by manually or fully automatic system.
Etching conditions:
- RF power: 100...800 W
- Ion energy: 0,8...400 eV
- Working pressure: 1...1x10-2 Pa
- Gases: Ar, N2, O2, Cl2, BCl3, SF6 and 2 reserve channels.
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Contact evaporation system
under modernization
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System of thinning of samples
the stage of construction.
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Laboratory cutting system
the stage of development.
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Lithography facilities available in the cooperation with other Labs.
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Processing of device structures is carried out with cooperation of Laboratory of Semiconductor Quantum Electronics
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